This New Apple Invention Could Make MacBooks Thinner
Will Apple’s (NASDAQ:AAPL) future laptops become even thinner? A recently published patent application reveals that Apple has developed a method “for creating a flexible structure from a rigid material,” reports Patently Apple. This method could be used to “create an enclosure, a cover for an electronic device, one or more hinges, or the like,” which should allow Apple to reduce the overall width of its hinged devices.
In the patent titled “Interlocking Flexible Segments Formed From a Rigid Material,” Apple noted that this hinged structure can be made out of a variety of materials since the method is based on a particular design rather than the composition of the material itself. The Cupertino-based company noted that the structure can be made from “metals, alloys, hard plastics,” and many other materials.
The particular geometric pattern that is cut into the material determines how far the hinge will bend. This allows the structure to be used as an enclosure for electronic components without compromising the components inside by flexing past their breaking point.