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Intel Corporation (NASDAQ:INTC): Last week, new issues in the U.S. dollar corporate bond market was able to reach $30 billion. Some are wondering who is borrowing, and what the borrower is doing with the money? Intel is the leader of the billion-dollar borrowers brigade with $6 billion spread over five-, 10-, 20-, and 30-year paper. The money will be used as a means to fund a share buyback.
Broadcom Corp. (NASDAQ:BRCM): Broadcom chief Scott McGregor isn’t going tolet one of his main rivals claim such large swaths of the mobile world; he tells investors that his company will have test samples of its own LTE chipsets in 2013, acknowledging that the company is “not there” with its progress towards advanced wireless.
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QUALCOMM Incorporated (NASDAQ:QCOM) possesses a strong grip on the LTE chipset market, since there are particular exceptions such as Samsung’s in-house designs, and often, the company is gatekeeper for modern 4G.
ARM Holdings plc (NASDAQ:ARMH) is nearing the formation of a historic technology powerhouse in China while CEO Warren East will lead the business to new global heights. This proposed joint venture business has the potential to allow more secure payments along with additional key features regarding mobile phones in the burgeoning Chinese market.
Western Digital Corp. (NYSE:WDC): The U.S. Court of Appeals for the Federal Circuit has supported a lower court ruling regarding a patent infringement suit that was brought by Rembrandt Data Storage against Western Digital and Seagate Technology (NASDAQ:STX). Last month, in its 10-Q, Western Digital claimed, “After a favorable claim construction ruling by the court, Western Digital secured a stipulation from [Rembrandt] to dismiss the case. [Rembrandt] has appealed the Court’s claim construction ruling, and the parties await a hearing on the appeal.” These patents allegedly concern particular thin film heads having solenoid coils, reveals Western Digital’s quarterly filing.
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